package assembly
英 [ˈpækɪdʒ əˈsembli]
美 [ˈpækɪdʒ əˈsembli]
网络 组装结构
双语例句
- Typically, each package would be in a separate assembly to allow maintenance and distribution of the package content.
通常，每个包都位于一个单独的程序集中以便维护和分发包的内容。 - Do you think the tax increase package get through the national assembly without trouble?
你想加税的提案在国民大会上会顺利通过吗？ - The namespace may be defined in the script by using the package statement, or an external assembly may provide it.
命名空间可以在脚本中使用package语句来定义，或者外部程序集可能会提供命名空间。 - Full& half size package for PCB assembly.
全形，半形尺寸供不同电路板组装。 - The generation software package of the assembly drawing and the machine drawings of all parts in the cylinder.
变幅油缸设计数据库、图形库的建立和使用；变幅油缸设计软件、零件图、装配图生成软件的开发研究。 - A Verification System for Package Assembly Function of IPOA
IPOA组包功能的验证系统 - TPFAP& a Code Package for LWR Fuel Assembly Calculation
轻水堆燃料组件计算程序包TPFAP - It is practicable in the package, assembly and transit domain.
该视觉伺服系统在机器人包装、装配、搬运等领域具有很强的实用价值。 - RTL ( register transfer level) functional verification system for package assembly function in IPOA application is illustrated in this paper.
介绍一种对IPOA应用中的组包功能进行RTL功能验证的系统。 - BGA and Flip Chip are the two main categories of area array package, as a package form of large scale integrated circuit, they gain the attention of electronic assembly industry, and have been used in some applications.
BGA和flipchip是面积阵列封装的两大类型，它们作为当今大规模集成电路的封装形式，引起了电子组装界的关注，而且逐渐在不同领域得到应用。 - The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。 - This paper discusses the design tradeoffs, the package construction and assembly, and test results.
论述了设计优化、组件结构与组装技术以及测试结果。 - Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability
等离子清洗工艺对PBGA组装可靠性的影响 - In order to find the solution of this problem, it has been focused to reduce the overall process cost, such as package assembly, final electrical test and etc.
为了寻找解决这一问题的方法，焦点便集中在减少总的加工成本，例如封装、组装以及最终的电气测试等方面。 - Quad Flat No-lead ( QFN) package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。 - With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.
热循环模拟是在封装、焊球和PCB基板的任一节点上施加相同的温度载荷，忽略了整个封装体内温度梯度的存在。 - Present the contents of every section of the standard according to the original JIS Z 3198 1-7.The purpose is to improve the lead-free process in electronic package and assembly in China.
依据JISZ31981-7原文对该标准各部分进行介绍，拟推进我国电子封装与组装的无铅化进程。 - Therefore, through the use of existing data modeling tools and mature commercial simulation software package to develop a data-driven modeling and simulation method of automobile general assembly line production has an important value.
因此，通过利用现有的数据建模工具和成熟的商业仿真软件包开发基于数据驱动的汽车总装线生产建模仿真方法具有重要的应用价值。